Ansys Software
Ansys Icepak
Cooling Simulation Software for Electronic Components
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.
Electronics Cooling & PCB Thermal Simulation and Analysis
Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).
Product Specs
Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.
Key Features
Icepak includes all modes of heat transfer — conduction, convection and radiation — for steadystate and transient electronics cooling applications.
- Electronics Desktop 3D layout GUI
- DC joule heating analysis
- Multiple-fluid analysis
- Reduced order flow and thermal
- Thermo-electric cooler modeling
- Package characterization
- Integrated graphical modeling environment